Ultra Thin Pure Copper Heat Sink Back Memory RAM Sink Cooling For MOS IC Chip,Back Memory RAM Sink Cooling For MOS IC Chip Ultra Thin Pure Copper Heat Sink, easy to install and use,Item Type: Copper Heat Sink, 1X Copper Heat Sink, Material: Pure Copper, Dissipates the RAM heat improve its performance, Adhesive tape with high thermal conductivity, Small size and light weight, Discount Supplements 24 hours to serve you Lower Prices for Everyone outstanding service an easy way to order. Chip Ultra Thin Pure Copper Heat Sink Back Memory RAM Sink Cooling For MOS IC.
Ultra Thin Pure Copper Heat Sink Back Memory RAM Sink Cooling For MOS IC Chip. Item Type: Copper Heat Sink. 1X Copper Heat Sink. Material: Pure Copper. Dissipates the RAM heat improve its performance. Adhesive tape with high thermal conductivity. Small size and light weight, easy to install and use.. Condition:： New: A brand-new, unused, unopened, undamaged item in its original packaging (where packaging is applicable). Packaging should be the same as what is found in a retail store, unless the item is handmade or was packaged by the manufacturer in non-retail packaging, such as an unprinted box or plastic bag. See the seller's listing for full details. See all condition definitions ： Brand: ： Unbranded ， Country/Region of Manufacture: ： China： MPN: ： Does Not Apply ， UPC: ： Does not apply ， 。
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